Product Overview
The High Repetition Frequency Green Picosecond Laser is an advanced ultrafast laser source designed for high-precision micromachining and materials processing applications. Operating at a wavelength of 532 nm (green light) with picosecond pulse durations, this laser delivers exceptional beam quality combined with high repetition rates, enabling superior processing quality with minimal thermal damage to surrounding materials.
With pulse widths typically under 15 picoseconds, the laser operates in the cold ablation regime, significantly reducing the heat-affected zone (HAZ) and enabling micro-scale processing with sub-micron precision. The high repetition rate capability — ranging from a few kilohertz to several megahertz — ensures high throughput production efficiency without compromising processing quality.
Key Features
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High Repetition Frequency: Supports repetition rates from single shot up to 80 MHz across different product configurations, with high-power industrial models achieving 1-6 MHz continuously.
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Picosecond Pulse Duration: Provides ultra-short pulses (<7 ps to 50 ps) to minimize thermal effects and achieve high-quality cold ablation results.
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High Output Power: Available in various power levels from several hundred milliwatts for research to over 50 watts for demanding industrial applications.
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Exceptional Beam Quality: Achieves TEM₀₀ spatial mode with M² <1.3, ensuring uniform energy distribution and excellent focusing capability.
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Flexible Pulse Control: Supports burst mode output, pulse-on-demand (POD) triggering, and position-synchronized output (PSO) for comprehensive process control.
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Compact & Rugged Design: Turn-key laser systems with integrated electronics, suitable for OEM integration and 24/7 industrial operation.
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High Stability: Long-term power stability (<1-2% over 8 hours) and pulse-to-pulse energy stability for consistent processing results.
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Applications
The High Repetition Frequency Green Picosecond Laser is widely adopted across various high-precision industries:
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Semiconductor Processing: Wafer dicing, silicon and SiC cutting, solar cell scribing, ITO patterning
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Display & Electronics: OLED cutting, FPC flex circuit processing, PCB micro-machining
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Precision Materials Processing: Glass, sapphire, and ceramic cutting and drilling
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Medical Device Manufacturing: Stent cutting, bio-microincision
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Scientific Research: Multi-photon imaging (CARS, SRS), nonlinear spectroscopy, multi-photon 3D printing
The 532 nm wavelength offers superior absorption characteristics for metals and many transparent materials, while the high repetition frequency enables high-speed scanning and processing, making it an ideal light source for both R&D and industrial production environments.
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